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Brand Name : TY
Model Number : At customer's requested
Certification : ISO, RoHs
Place of Origin : China
MOQ : 5 kgs
Price : 1-100usd
Payment Terms : T/T, Western Union,paypal
Supply Ability : 5 tons per month
Delivery Time : 3-35 days
Packaging Details : wooden case
Materia : Copper Tungsten Alloy
Product Standard : ASTM B 702
Class : W50/Cu50 - W90/Cu10
Density : 11.85 - 16.75
Hardness : 115-260
Product Name : Copper Heat Sink
WCu Copper Tungsten AlloyTungsten Copper Heat Sink with 25 wt.% Cu
Description:
Tungsten copper heat sink is used for transferring heat generated in microelectronic components to prevent thermal damage.
Application:
They are extensively used as thermal mounting plates, chip carriers, tungsten copper flanges, and frames for RF, light emitting diodes and detectors, laser diode packages like pulse, single emitter, bars and complex carriers for optoelectronics amplifiers, receivers, transmitters, tunable lasers, etc.
Advantages:
1. High thermal conductivity
2. Excellent hermeticity
3. Excellent flatness, surface finish, and size control
Product Properties:
Grade | W Content | Density g/cm3 |
Coefficient of thermal Expansion ×10-6 (20℃) |
Thermal conductivity W/(M·K) |
90WCu | 90±2% | 17.0 | 6.5 | 180 (25℃) /176 (100℃) |
85WCu | 85±2% | 16.4 | 7.2 | 190 (25℃) / 183 (100℃) |
80WCu | 80±2% | 15.65 | 8.3 | 200 (25℃) / 197 (100℃) |
75WCu | 75±2% | 14.9 | 9.0 | 230 (25℃) / 220 (100℃) |
50WCu | 50±2% | 12.2 | 12.5 | 340 (25℃) / 310 (100℃) |
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75W25Cu Class Copper Tungsten Alloy Thermal Damage Preventing Use Images |